AvantGo series
先进封装贴片/固晶机
□支持工艺:FOWLP (Face Up/Down),2.5D/3D,POP,SiP,MCM,EMCP,
Flip chip,FCCSP,FCBGA,Stack Die
□供料方式:Wafer,Waffle try feeder,Carrier cassette,FOUP,Tape reel, JEDEC
□超高精度:±1um,±3um,±5um,±7um
□超高产能:12K UPH,10K UPH,8K UPH,5K UPH
□超高灵活性:Face Up/Face Down自由转换,DAF加热,Fluex,Dispensing
□更多Die尺寸:大小:0.5~0.9mm,30~70mm;厚度:0.05mm~2mm